JPH0258027B2 - - Google Patents

Info

Publication number
JPH0258027B2
JPH0258027B2 JP63062030A JP6203088A JPH0258027B2 JP H0258027 B2 JPH0258027 B2 JP H0258027B2 JP 63062030 A JP63062030 A JP 63062030A JP 6203088 A JP6203088 A JP 6203088A JP H0258027 B2 JPH0258027 B2 JP H0258027B2
Authority
JP
Japan
Prior art keywords
solder
wire
tip
blotting
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63062030A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01237073A (ja
Inventor
Seiji Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AHORO SEIKO KK
Original Assignee
AHORO SEIKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AHORO SEIKO KK filed Critical AHORO SEIKO KK
Priority to JP6203088A priority Critical patent/JPH01237073A/ja
Priority to PCT/JP1989/000190 priority patent/WO1989008527A1/ja
Publication of JPH01237073A publication Critical patent/JPH01237073A/ja
Publication of JPH0258027B2 publication Critical patent/JPH0258027B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H05K13/0491—Hand tools therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP6203088A 1988-03-17 1988-03-17 再半田付け装置及びそれを用いた再半田付け方法 Granted JPH01237073A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6203088A JPH01237073A (ja) 1988-03-17 1988-03-17 再半田付け装置及びそれを用いた再半田付け方法
PCT/JP1989/000190 WO1989008527A1 (en) 1988-03-17 1989-02-23 Method and apparatus for removing defective solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6203088A JPH01237073A (ja) 1988-03-17 1988-03-17 再半田付け装置及びそれを用いた再半田付け方法

Publications (2)

Publication Number Publication Date
JPH01237073A JPH01237073A (ja) 1989-09-21
JPH0258027B2 true JPH0258027B2 (en]) 1990-12-06

Family

ID=13188360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6203088A Granted JPH01237073A (ja) 1988-03-17 1988-03-17 再半田付け装置及びそれを用いた再半田付け方法

Country Status (2)

Country Link
JP (1) JPH01237073A (en])
WO (1) WO1989008527A1 (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5072874A (en) * 1991-01-31 1991-12-17 Microelectronics And Computer Technology Corporation Method and apparatus for using desoldering material
CN104439596A (zh) * 2014-11-14 2015-03-25 柳州市安龙机械设备有限公司 焊枪
CN104475908A (zh) * 2014-11-14 2015-04-01 柳州市安龙机械设备有限公司 自动焊枪
CN106392240B (zh) * 2016-12-05 2018-07-31 辽宁工程技术大学 一种一体化锡焊手柄
CN110977078B (zh) * 2019-12-04 2021-05-25 绍兴柯桥星蓝能环境科技有限公司 一种异形电池输出导线焊接器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS517428U (en]) * 1974-07-06 1976-01-20
US4164606A (en) * 1977-11-08 1979-08-14 Ernst Spirig Tinned copper braids for solder removing
JPS5543657U (en]) * 1978-09-13 1980-03-21
JPS5634849Y2 (en]) * 1978-12-09 1981-08-17
JPS58119965U (ja) * 1982-02-05 1983-08-16 大日機工株式会社 産業用ロボツトのはんだ付用ハンド
JPS60121067A (ja) * 1983-12-01 1985-06-28 Mitsubishi Electric Corp ハンダ自動供給装置付ハンダごて
JPS60166465U (ja) * 1984-04-13 1985-11-05 日本電気株式会社 万能はんだごて
JPS61200649U (en]) * 1985-06-04 1986-12-16
JPH0248133Y2 (en]) * 1986-02-25 1990-12-18

Also Published As

Publication number Publication date
WO1989008527A1 (en) 1989-09-21
JPH01237073A (ja) 1989-09-21

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